Fischer SMD Heat Sink ICK SMD Series
[SMD Thermal Management] Heat Sink for Surface Mount ICs | Compact and Lightweight for Space-Saving on Circuit Boards (Manufactured by Fischer Elektronik)
For extending the lifespan and improving the reliability of surface-mounted devices. A retrofittable SMD-specific heat sink. With the downsizing of electronic devices, the heat density of power devices and high-function ICs on circuit boards has surged. Fischer Elektronik's "ICK SMD Series" is designed to maximize heat dissipation effects in the limited space available on circuit boards. **Benefits of SMD Thermal Management** Direct attachment to IC packages: Optimized for major surface-mounted package sizes such as SOIC, SSOP, and TSSOP. Efficiently dissipates heat directly above the heat source using thermal adhesive pads and other methods. Excellent space efficiency: Adopts a fin structure that minimizes the occupied area on the circuit board while maximizing surface area. The fin height is also kept low, making it suitable for integration into slim devices. Lightweight and made of aluminum: Consideration is given to the load on the circuit board after installation. **Compatible with a wide range of manufacturing processes (optional)** Soldering compatible: By choosing the solderable surface (MI type), direct fixation to the circuit board is possible. Taped products: There are also types available that are supplied in tape form (TR type).
- Company：Axuas Co., Ltd.
- Price：Other
